Validating pad printing process

Posted by / 12-Jun-2017 23:12

The goal of this paper is to apply the statistical approach from model validation to inferences to the 01005 component stencil printing evaluation and to examine the effect of process parameters on the solder paste release efficiency and the process capability.

First, through a gage repeatability and reproducibility (GR&R) study, the inspection system is found to be acceptable for measuring solder deposit volume for 01005 components.

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Electroformed stencil tends to be better than laser cut stencil in terms of solder paste release efficiency by between 14% and 30% of the aperture volume with confidence level of 95%.

An aperture size designed as 110% of the pad size can have the mean solder deposit volume as between 89% and 144% with 95% confidence level.

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However, problems arise during the analysis of the results.

Statistical approaches such as design of experiment (DOE) are widely known because the statistical package program is commercially available and is ease to use.

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